LAYOUT
The IRDC3622D is an eight-layer board. The top and bottom layers are 2 Oz. copper and the internal layers are
1 Oz. copper. The switching MOSFETS, Inductors, 270uF input capacitors, output capacitors, and some smaller
passive components are mounted on the top side of the board. The IR3622 IC and the rest of passive
components are mounted on the bottom layer. The DirectFET technology is used for MOSFETs.
Fig. 2: Parts placement, the top layer.
Fig. 3: Parts placement, the bottom layer.
www.irf.com
RD-0621
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相关PDF资料
IRDC3622S BOARD EVALUATION W/IR3622MPBF
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